<p><em>强固的压铸模模块简化紧凑的电机驱动设计</em></p>

<p><span>推动高能效创新的安森美半导体 (ON Semiconductor，美国纳斯达克上市代号：</span><a href="http://www.onsemi.cn/PowerSolutions/ir.do"><span>ON</span></a><span&gt;)，</span><span>推出</span><a href="https://www.onsemi.cn/products/power-modules/igbt-modules?utm_source=ne…;新的、集成的、转换器-逆变器-功率因数校正 (</span></a><a href="https://www.onsemi.cn/products/power-modules/igbt-modules?utm_source=ne… href="https://www.onsemi.cn/products/power-modules/igbt-modules?utm_source=ne…;模块</span></a><span>，</span><span>用于</span><span>在</span><a href="https://www.onsemi.cn/solution/industrial-cloud-power/industrial-power-…;工业</span></a><a href="https://www.onsemi.cn/solution/industrial-cloud-power/industrial-power-…;电机驱动</span></a><span>、伺服驱动和</span><span>暖通空调 (</span><span>HVAC)</span><span><span>&nbsp;</span></span><span>中</span><span>驱动</span><span>风扇和泵</span><span>等应用</span><span>的电机。</span></p>

<p><span>新的</span><a href="https://www.onsemi.cn/products/power-modules/igbt-modules/nxh50m65l4c2s…;和</span><a href="https://www.onsemi.cn/products/power-modules/igbt-modules/nxh50m65l4c2e…;分别是基于标准氧化铝</span><span><span>&nbsp;</span>(</span><span>AI2O3</span><span>)</span><span><span>&nbsp;</span></span><span>基板</span><span>和增强型低热阻</span><span>基板</span><span>的</span><span><span>压铸</span></span><span><span>模功率集成</span></span><span>模块</span><span><span>&nbsp;</span>(</span><span>TMPIM</span><span>)</span><span><span>&nbsp;</span></span><span>。这些模块非常适用于具有高输出功率的</span><span>强</span><span>固工业应用，</span><span>它们</span><span>包含一个转换器-逆变器-PFC电路，由</span><span>集成</span><span>四个75</span><span><span>&nbsp;</span></span><span>A、1600</span><span><span>&nbsp;</span></span><span>V整流器的单相转换器组成。三相逆变器使用6个</span><span>集成</span><span>反向二极管</span><span>的</span><span>50 A、600 V的IGBT，双通道交错式PFC包括两个</span><span>集成</span><span>反向二极管</span><span>的</span><span>75 A、650 V</span><span><span>&nbsp;</span></span><span>PFC IGBT，和两个50 A、650 V</span><span><span>&nbsp;</span></span><span>PFC二极管。</span><span>压铸</span><span>模功率集成</span><span>模块</span><span>嵌入了一个</span><span>负温系数 (</span><span>NTC</span><span>)<span>&nbsp;</span></span><span>热敏电阻，以在</span><span>工作</span><span>期间监测器件温度。</span></p>

<p><span>由于该模块以优化的布局和配置进行预</span><span>封</span><span>装，与基于 PCB 的分立设计相比，寄生元</span><span>素</span><span>非常小，从而</span><span>实现</span><span>在 18 kHz 和 65 kHz 之间</span><span>的</span><span>宽 PFC 开关频率范围。 高</span><span>能</span><span>效的 NXH50M65L4C2SG 和 NXH50M65L4C2ESG 额定电流为 50 A，</span><span>能</span><span>在高达 8 kW 的应用中使用，是</span><a href="https://www.onsemi.cn/PowerSolutions/newsItem.do?article=4536&amp;utm_s…;安森美半导体 TMPIM 系列</span></a><span>的最新器件。其他</span><span>器件</span><span>的额定电流为 20 A 和 30 A。</span></p>

<p><span>紧凑的压铸模DIP-26封装尺寸仅73毫米x</span><span><span>&nbsp;</span></span><span>47毫米x</span><span><span>&nbsp;</span></span><span>8毫米--比当前的方案节省20%的面积，实现了更高的功率密度水平。密封和强固的封装</span><span>包括</span><span>一个</span><span>集成</span><span>散热</span><span>片</span><span>（</span><span>距</span><span>引脚6毫米），并提供高水平的耐腐蚀性。</span></p>

<p><span>安森美半导体还提供碳化硅<span>&nbsp;</span></span><span>(SiC)<span>&nbsp;</span></span><span>配置选项以进一步提高开关频率和能效。</span></p>

<p><span>新的NXH50M65L4C2SG和NXH50M65L4C2ESG配以</span><a href="https://www.onsemi.cn/products/power-management/ac-dc-controllers-regul… PFC控制器</span></a><span>和</span><a href="https://www.onsemi.cn/products/discretes-drivers/gate-drivers?utm_sourc…;门极驱动器方案，</span></a><a href="https://www.onsemi.cn/products/discretes-drivers/gate-drivers?utm_sourc…;包括新的NCD5700x系列器件</span></a><span>。最近推出的</span><a href="https://www.onsemi.cn/products/discretes-drivers/gate-drivers/ncd57252?…双通道隔离型IGBT/MOSFET门极驱动器</span></a><span>提供5 kV的电隔离，可配置为双下桥、双上桥或半桥工作。NCD57252采用小型SOIC-16宽体封装，接受逻辑电平输入（3.3 V、5 V和15 V）。该高电流器件（在米勒平台电压下，源电流4.0 A/灌电流6.0 A）适合高速工作，因为典型传播延迟为60 ns。</span></p>

<p><span>以最</span><span>高</span><span>能</span><span>效的方式驱动电机是简化安装、降低热量积聚、提高可靠性以及降低系统成本的关键。 安森美半导体</span><span>的</span><span><span>&nbsp;</span>TMPIM 器件</span><span>将</span><span>输出引脚</span><span>标准化，最</span><span>小化</span><span>寄生</span><span>元素</span><span>，为设计人员提供高性能的“即插即用”方案。 将 NXH50M65L4C2SG 和 NXH50M65L4C2ESG 与 FAN9672 和 NCD57252 相结合，提供一</span><span>个</span><span>快速设计路径，以实现</span><span>精密</span><span>高</span><span>能</span><span>效的电机控制方案。</span></p>

<p><span>在<span>&nbsp;</span></span><a href="https://apec-conf.org/"><span>APEC 2021</span></a><span><span>&nbsp;</span>期间，安森美半导体将展示用于工业应用的<span>&nbsp;</span></span><a href="https://www.onsemi.cn/products/wide-bandgap?utm_source=news_brief&amp;u…方案</span></a><span>。欲注册观展，请访问</span><a href="http://apec-conf.org/conference/registration/"><span>http://apec-conf.o…;。</span></p>

<p><strong>关于安森美半导体</strong><br />
<span>安森美半导体(ON Semiconductor，美国纳斯达克上市代号：</span><a href="http://www.onsemi.cn/"><span>ON</span></a><span&gt;)致力于推动高能效电子创新，使世界更绿、更安全、包容及互联。公司已转变为客户首选的电源、模拟、传感器及联结方案供应商。公司卓越的产品帮助工程师解决他们在汽车、工业、云电源及物联网(IoT)应用中最独特的设计挑战。</span></p>

<p><span>安森美半导体运营反应敏锐、可靠的供应链及品质项目，及强大的 环境、社会、公司管治(ESG)计划。公司总部位于美国亚利桑那州菲尼克斯，在其主要市场运营包括制造厂、销售办事处及设计中心在内的全球业务网络。更多信息请访问http://www.onsemi.cn。</span></p>